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Kimchuk Heatsink to Printed Circuit Board Bonding

The bonded assembly is very tolerant of a wide temperature range.


The bonded pull strength can range from an excess of one hundred pounds per square inch when attached directly to the substrate or metal or the assembly can be bonded to solder mask and result in a bond strength as strong as the bond of the masking or coating is to the substrate.


There is no practical limit to the size or the square inches of the assembly or heatsink.


The bond is water tight and thus heatsinks can be air or water cooled


Each application is unique. Contact KimchuK, Inc Sales Department for a technical conference with our Engineering Department.


KimchuK, Inc.

Sales Department

1 Corporate Drive

Danbury, Conn.06810