Heatsink Bonding Services

Kimchuk, Inc has developed a proprietary process for bonding simple to complex heatsinks or mechanical assemblies directly to Printed Circuit Boards of many different substrates as well as bonding to other materials such as metal to metal.

The bonded assembly is very tolerant of a wide temperature range.

The bonded pull strength can range from an excess of one hundred pounds per square inch when attached directly to the substrate or metal or the assembly can be bonded to solder mask and result in a bond strength as strong as the bond of the masking or coating is to the substrate.

There is no practical limit to the size or the square inches of the assembly or heatsink.

The bond is water tight and thus heatsinks can be air or water cooled

Each application is unique. Contact KimchuK, Inc Sales Department for a technical conference with our Engineering Department.